By Karl J. Puttlitz
This reference presents a whole dialogue of the conversion from common lead-tin to lead-free solder microelectronic assemblies for low-end and high-end purposes. Written through greater than forty five world-class researchers and practitioners, the e-book discusses normal reliability concerns relating microelectronic assemblies, in addition to elements particular to the tin-rich alternative alloys in general used in lead-free solders. It presents real-world production money owed of the advent of reduced-lead and lead-free expertise and discusses the performance and price effectiveness of different solder alloys and non-solder choices changing lead-tin solders in microelectronics.
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