This e-book specializes in foundry-based procedure know-how that permits the fabrication of three-D ICs. The middle of the publication discusses the know-how platform for pre-packaging wafer lever three-D ICs. despite the fact that, this e-book doesn't comprise an in depth dialogue of three-D ICs layout and 3D packaging. this is often an edited publication in accordance with chapters contributed by way of numerous specialists within the box of wafer-level 3D ICs approach know-how. they're from academia, learn labs and industry.
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